Torthaí cuardaigh - Jingwei Bi

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    Vancomycin-encapsulated hydrogel loaded microarc-oxidized 3D-printed porous Ti6Al4V implant for infected bone defects: Reconstruction, anti-infection, and osseointegration

    Vancomycin-encapsulated hydrogel loaded microarc-oxidized 3D-printed porous Ti6Al4V implant for infected bone defects: Reconstruction, anti-infection, and osseointegration de réir Teng Zhang, Wenhao Zhou, Wanliang Yang, Jingwei Bi, Hao Li, Xianlei Gao, Baoliang Zhang, Guidong Shi, Ka Li, Zhijian Wei, Xin Pan, Shiqing Feng

    Foilsithe / Cruthaithe 2024
    Faigh an téacs iomlán
    Artigo
    Cuir le mo chuid Ceanán
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